In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
This report contains market size and forecasts of Integrated Circuit Packaging Solder Ball in global, including the following market information:
Global Integrated Circuit Packaging Solder Ball Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Integrated Circuit Packaging Solder Ball Market Sales, 2017-2022, 2023-2028, (M Units)
Global top five Integrated Circuit Packaging Solder Ball companies in 2021 (%)
The global Integrated Circuit Packaging Solder Ball market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Lead Solder Ball Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Integrated Circuit Packaging Solder Ball include Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology and Nippon Micrometal, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Integrated Circuit Packaging Solder Ball manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Integrated Circuit Packaging Solder Ball Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (M Units)
Global Integrated Circuit Packaging Solder Ball Market Segment Percentages, by Type, 2021 (%)
Lead Solder Ball
Lead Free Solder Ball
Global Integrated Circuit Packaging Solder Ball Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (M Units)
Global Integrated Circuit Packaging Solder Ball Market Segment Percentages, by Application, 2021 (%)
BGA
CSP & WLCSP
Flip-Chip & Others
Global Integrated Circuit Packaging Solder Ball Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (M Units)
Global Integrated Circuit Packaging Solder Ball Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Integrated Circuit Packaging Solder Ball revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Integrated Circuit Packaging Solder Ball revenues share in global market, 2021 (%)
Key companies Integrated Circuit Packaging Solder Ball sales in global market, 2017-2022 (Estimated), (M Units)
Key companies Integrated Circuit Packaging Solder Ball sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Jovy Systems
SK Hynix