In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
This report contains market size and forecasts of Lead Free Solder Spheres in global, including the following market information:
Global Lead Free Solder Spheres Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Lead Free Solder Spheres Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Lead Free Solder Spheres companies in 2021 (%)
The global Lead Free Solder Spheres market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Up to 0.2 mm Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Lead Free Solder Spheres include Senju Metal, Accurus, DS HiMetal, NMC, MKE, PMTC, Indium Corporation, YCTC and Shenmao Technology and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Lead Free Solder Spheres manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Lead Free Solder Spheres Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Lead Free Solder Spheres Market Segment Percentages, by Type, 2021 (%)
Up to 0.2 mm
0.2-0.5 mm
Above 0.5 mm
Global Lead Free Solder Spheres Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Lead Free Solder Spheres Market Segment Percentages, by Application, 2021 (%)
BGA
CSP & WLCSP
Flip-Chip & Others
Global Lead Free Solder Spheres Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Lead Free Solder Spheres Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Lead Free Solder Spheres revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Lead Free Solder Spheres revenues share in global market, 2021 (%)
Key companies Lead Free Solder Spheres sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Lead Free Solder Spheres sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Senju Metal
Accurus
DS HiMetal
NMC
MKE
PMTC
Indium Corporation
YCTC
Shenmao Technology
Shanghai hiking solder material