MEMS Packaging is a method of protecting microelectromechanical system (MEMS) devices from the environment by means of physical enclosures.
This report contains market size and forecasts of MEMS Packaging in Global, including the following market information:
Global MEMS Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global MEMS Packaging market was valued at 43610 million in 2021 and is projected to reach US$ 83180 million by 2028, at a CAGR of 9.7% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Inertial Sensors Packaging Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of MEMS Packaging include ChipMos Technologies Inc., AAC Technologies Holdings Inc., Bosch Sensortec GmbH, Infineon Technologies AG, Analog Devices, Inc., Texas Instruments Incorporated., Taiwan Semiconductor Manufacturing Company Limited, MEMSCAP and Orbotech Ltd. and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the MEMS Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global MEMS Packaging Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global MEMS Packaging Market Segment Percentages, by Type, 2021 (%)
Inertial Sensors Packaging
Optical Sensors Packaging
Environmental Sensors Packaging
Ultrasonic Sensors Packaging
Others
Global MEMS Packaging Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global MEMS Packaging Market Segment Percentages, by Application, 2021 (%)
Automotive
Mobile Phones
Consumer Electronics
Medical Systems
Industrial
Others
Global MEMS Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global MEMS Packaging Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies MEMS Packaging revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies MEMS Packaging revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
ChipMos Technologies Inc.
AAC Technologies Holdings Inc.
Bosch Sensortec GmbH
Infineon Technologies AG
Analog Devices, Inc.
Texas Instruments Incorporated.
Taiwan Semiconductor Manufacturing Company Limited
MEMSCAP
Orbotech Ltd.
TDK Corporation