This report contains market size and forecasts of Wafer Back Grinding Tapes in global, including the following market information:
Global Wafer Back Grinding Tapes Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Wafer Back Grinding Tapes Market Sales, 2017-2022, 2023-2028, (K Sqm)
Global top five Wafer Back Grinding Tapes companies in 2021 (%)
The global Wafer Back Grinding Tapes market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
UV Type Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Wafer Back Grinding Tapes include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology, Force-One Applied Materials and AMC Co, Ltd and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Wafer Back Grinding Tapes manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Back Grinding Tapes Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)
Global Wafer Back Grinding Tapes Market Segment Percentages, by Type, 2021 (%)
UV Type
Non-UV Type
Global Wafer Back Grinding Tapes Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)
Global Wafer Back Grinding Tapes Market Segment Percentages, by Application, 2021 (%)
Standard
Standard Thin Die
(S)DBG(GAL)
Bump
Global Wafer Back Grinding Tapes Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)
Global Wafer Back Grinding Tapes Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Back Grinding Tapes revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Wafer Back Grinding Tapes revenues share in global market, 2021 (%)
Key companies Wafer Back Grinding Tapes sales in global market, 2017-2022 (Estimated), (K Sqm)
Key companies Wafer Back Grinding Tapes sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
Force-One Applied Materials
AMC Co, Ltd
Pantech Tape Co., Ltd